At the Embedded World Exhibition & Conference, Qualcomm Technologies, Inc. is at the center of digital transformation by demonstrating its significant presence in the embedded and IoT ecosystem and continuing to accelerate innovation across the industry. More than 35 companies, including embedded design centers, distributors, and independent software vendors, will showcase Qualcomm® processor-powered solutions across robotics, manufacturing, asset and fleet management, edge AI boxes, automotive solutions, and more. I am.
At Embedded World, Qualcomm Technologies will announce additions to its portfolio of products and solutions designed to help customers in the embedded ecosystem. The new Qualcomm® QCC730 Wi-Fi Solution and Qualcomm® RB3 Gen 2 Platform deliver significant upgrades that enable on-device AI, high performance, low-power processing, and connectivity for the latest IoT products and applications.
Qualcomm Technologies also introduces the Qualcomm® QCC730, a disruptive micropower Wi-Fi system for IoT connectivity. This technological advancement delivers up to 88% less power than previous generations and can revolutionize products for battery-powered industrial, commercial, and consumer applications. QCC730 is complemented by an open source IDE and SDK that supports cloud connectivity offload to ease development. Its versatility also allows developers to implement his QCC730 as a high-performance replacement for his Bluetooth® IoT applications, offering flexible design and direct connectivity to the cloud. Qualcomm Technologies also offers his family of IoT connectivity products, including the QCC711, a tri-core ultra-low power Bluetooth® Low Energy SoC, and his QCC740, an all-in-one solution that supports Thread, Zigbee, Wi-Fi, and Bluetooth. .
The new Qualcomm RB3 Gen 2 Platform is a comprehensive hardware and software solution designed for IoT and embedded applications. Powered by the Qualcomm® QCS6490 processor, RB3 Gen 2 delivers a combination of high-performance processing, 10x on-device AI processing, support for four 8MP+ camera sensors, computer vision, and integrated Wi-Fi 6E. RB3 Gen 2 is expected to be used in a wide range of products including various types of robots, drones, industrial handheld devices, industrial and connected cameras, AI edge boxes, intelligent displays, etc. The platform is currently available for pre-order with two integrated development kits and supports downloadable software updates that simplify application development, integration, and building proofs of concept and prototypes.
RB3 Gen 2 is also supported by the recently announced Qualcomm AI Hub. The hub includes a continuously updated library of pre-optimized AI models that deliver superior on-device AI performance, reduced memory usage, and power-optimized behavior. This enables out-of-the-box, optimized experiences across a variety of widely used AI models deployed across IoT and embedded applications. Developers can view a selection of RB3 Gen 2 models and integrate optimized AI models into their applications, reducing time to market and improving immediacy, reliability, privacy, personalization, and cost. Take full advantage of the benefits of on-device AI implementation, such as .
RB3 Gen 2 features support for Qualcomm® Linux®. It is a comprehensive package of OS, software, tools, and documentation precisely designed for Qualcomm Technologies' IoT platform. We offer an integrated Linux distribution for multiple SoCs, including the QCS6490 processor, with essential components such as long-term support (LTS) kernels, and a consistently great developer experience. The Qualcomm Linux software stack extends support to all processor cores, subsystems, and components within the platform. Qualcomm Linux is currently available in private preview with some contributors and is expected to be widely available to developers in the coming months.
To expand its open source expertise and accelerate product commercialization with Qualcomm Linux, Qualcomm Technologies recently launched an open source, cloud-native solution that abstracts the complexity of developing and updating Linux-based IoT and edge devices. We acquired platform provider Foundries.io.
Qualcomm Technologies expands its broad portfolio of IoT solutions with the introduction of an industrial-grade platform focused on addressing functional safety, environmental and mechanical handling requirements in industrial applications. The platform supports system integrity level certification, wide operating temperature range, and industrial module packaging to meet deployment requirements in corporate and industrial environments. The solution is scheduled to be available in June 2024 and features a high-performance CPU, GPU, on-device AI capabilities, advanced safety camera ISP with support for multiple simultaneous cameras, and support for industrial I/O needs. Masu.
Rahul Patel, General Manager, Connectivity, Broadband, and Networking (CBN) Group, Qualcomm Technologies
Complementing high-performance, low-latency wireless connectivity solutions, the Qualcomm QCC730 SoC is an industry-leading micropower Wi-Fi solution that brings Wi-Fi to the world of battery-powered IoT platforms. The QCC730 allows devices to support TCP/IP networking capabilities while maintaining connectivity to cloud platforms while maintaining form factor and fully wireless constraints. This new product, along with the rest of his IoT connectivity portfolio, puts Qualcomm Technologies at the center of the next generation of battery-powered smart home, healthcare, gaming and other consumer electronics, leveraging decades of research and development. This reflects our commitment to Exploring new user consumption experiences.
Jeff Torrance, Senior Vice President and General Manager, Industrial and Embedded IoT, Qualcomm Technologies
At Embedded World, we look forward to showcasing our latest technology and collaborating with our ecosystem partners to help us continue to bring new and exciting IoT products to the industry. We are excited to introduce the RB3 Gen 2 platform, designed to bring advanced on-device AI capabilities to a wide range of mid-tier IoT applications. We will soon expand our IoT product portfolio to include high-performance industrial-grade solutions that bring a new era of intelligence, functional safety, and robust high-performance computing and I/O capabilities to the most demanding industrial applications. intend to do something. .
