SatixFy introduces next generation space chip technology
Written by Sophie Jenkins
London, UK (SPX) March 15, 2024
SatixFy Communications Ltd. (NYSE AMERICAN: SATX), a pioneer in satellite communications technology, brings its Prime 2.0 digital beamformer (DBF) chip and Sx4000 digital payload onboard processing chip for digital satellite payloads into advanced customer sampling stages. We have migrated. . These innovations are currently being evaluated by satellite manufacturers in both low Earth orbit (LEO) and geostationary orbit (GEO).
The Sx4000, which is essential for digital payload processing, is undergoing a final irradiation test to ensure it is ready for space. It is expected to be ready for flight by late 2024.
“Our progress with the Sx4000 and Prime 2.0 chips underscores our commitment to leading the next generation of satellite communications systems,” said Nir Barkan, acting CEO of SatixFy. We are excited about its market potential and the future of our technology.”
As a demonstration of technological advances, SatixFy will display its latest space chips at the Satellite Show in Washington, DC, March 19-21, 2024.
Designed for NGSO and GSO satellites, the Sx4000 chip represents a breakthrough in space-grade remanufactured chip technology, supports DVB-S2X and RCS2 standards, and is compatible with gateway multichannel receivers.
Similarly, the Prime 2.0 chip is at the forefront of satellite antenna technology, enabling the construction of electrically induced multibeam antennas (ESMA) that can scale up to 10,000 elements, offering unprecedented flexibility and performance.
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